PCBÉè¼Æ
ÁúÈËPCBÉè¼Æ·þÎñÖ÷Òª°üÀ¨£ºPCB Layout£¬PCB°åÉè¼Æ£¬PCBÔÀíÍ¼ÖÆ×÷£¬¸ßËÙPCBÉè¼Æ£¬¸ßÃÜ/¸ßƵµç·°åÉè¼Æ£¬PCB¸Ä°å£¬EMCµç´Å¼æÈÝÉè¼Æ,SIÐźŷÂÕæ·ÖÎö;
ÁúÈËPCBÉè¼ÆÊÒÔÚ±±¾©¡¢ÉîÛÚÁ½µØÓµÓÐ 100 Ãû´Óʼ¼Êõ¿ª·¢ºÍPCBÉè¼Æ¹¤×÷¶àÄêµÄÈí¡¢Ó²¼þ¹¤³Ìʦ£¬Äܸù¾Ý¿Í»§µÄÐèÇó , ÌṩÎÞÂÛË«Ãæ¡¢¶à²ã°å¡¢¸ßƵ°åµÈµç·°åµÄPCB³°å¡¢PCBÉè¼Æ¡¢PCB¸Ä°å¡¢ÔÀíͼÉè¼Æ¡¢PCB LAYOUT¡¢BOM±íÖÆ×÷¡¢Ñù»úÖÆ×÷£¨º¬µ÷ÊÔ£©¡¢³ÉÆ·ÅúÁ¿¼Ó¹¤¡¢¼¼ÊõÖ§³Ö¡¢PCBÉú²úÆ·Öʱ£Ö¤µÈ·þÎñ£¬ÎªÄú½ÚÔ¼´òÑùµ÷ÊÔ¼°¿ª·¢·ÑÓã¬Í¬Ê±ÐÖúÀ䯫ÃÅÔªÆ÷¼þµÄ²É¹º£¬¼æÈݹ¦ÄÜÆ÷¼þµÄÌæ»»¡¢Éè¼ÆÐźÅÔ´¡¢²âÊԼܵȡ£
ÎÒÃdzÐŵÒÔÓÅÖʵIJúÆ·ÖÊÁ¿¡¢µÍÁ®µÄ¼Û¸ñ¡¢ÍêÉÆ¼°Ê±µÄ¼¼ÊõÖ§³Ö£¬ËæÊ±ÎªÄãÌṩ·½±ã¿ì½Ý·þÎñ£¬²¢³ÏÖ¿»¶ÓÄúÀ´º¯À´µç»òÉÏÃŻݹË×ÉѯǢ̸ҵÎñ¡£ÓûÁ˽âÏêϸÐÅÏ¢ÇëµÇ½ÎÒË¾ÍøÕ¾»òÀ´º¯¡¢À´µç¡¢Ç×ÁÙ¹¤×÷ÊÒ¡£
ÁúÈËPCBÉè¼ÆÊÒÔÚ±±¾©¡¢ÉîÛÚÁ½µØÓµÓÐ 100 Ãû´Óʼ¼Êõ¿ª·¢ºÍPCBÉè¼Æ¹¤×÷¶àÄêµÄÈí¡¢Ó²¼þ¹¤³Ìʦ£¬Äܸù¾Ý¿Í»§µÄÐèÇó , ÌṩÎÞÂÛË«Ãæ¡¢¶à²ã°å¡¢¸ßƵ°åµÈµç·°åµÄPCB³°å¡¢PCBÉè¼Æ¡¢PCB¸Ä°å¡¢ÔÀíͼÉè¼Æ¡¢PCB LAYOUT¡¢BOM±íÖÆ×÷¡¢Ñù»úÖÆ×÷£¨º¬µ÷ÊÔ£©¡¢³ÉÆ·ÅúÁ¿¼Ó¹¤¡¢¼¼ÊõÖ§³Ö¡¢PCBÉú²úÆ·Öʱ£Ö¤µÈ·þÎñ£¬ÎªÄú½ÚÔ¼´òÑùµ÷ÊÔ¼°¿ª·¢·ÑÓã¬Í¬Ê±ÐÖúÀ䯫ÃÅÔªÆ÷¼þµÄ²É¹º£¬¼æÈݹ¦ÄÜÆ÷¼þµÄÌæ»»¡¢Éè¼ÆÐźÅÔ´¡¢²âÊԼܵȡ£
ÎÒÃdzÐŵÒÔÓÅÖʵIJúÆ·ÖÊÁ¿¡¢µÍÁ®µÄ¼Û¸ñ¡¢ÍêÉÆ¼°Ê±µÄ¼¼ÊõÖ§³Ö£¬ËæÊ±ÎªÄãÌṩ·½±ã¿ì½Ý·þÎñ£¬²¢³ÏÖ¿»¶ÓÄúÀ´º¯À´µç»òÉÏÃŻݹË×ÉѯǢ̸ҵÎñ¡£ÓûÁ˽âÏêϸÐÅÏ¢ÇëµÇ½ÎÒË¾ÍøÕ¾»òÀ´º¯¡¢À´µç¡¢Ç×ÁÙ¹¤×÷ÊÒ¡£
PCBÉè¼ÆÖ÷񻃾¼°²úÆ·ÃÅÀà
ÍøÂçÉ豸
À¶ÑÀÉ豸
C¡¢KU²¨¶Î¸ßƵͷ
À¶ÑÀÉ豸
C¡¢KU²¨¶Î¸ßƵͷ
´óÐÍ·ÓÉÆ÷
ÊýÂëÏà»ú¡¢ÊýÂëÉã¼»ú
ÆäËû¸ß¾«Ãܵç×Ó²úÆ·
ÊýÂëÏà»ú¡¢ÊýÂëÉã¼»ú
ÆäËû¸ß¾«Ãܵç×Ó²úÆ·
±Ê¼Ç±¾µçÄÔÖ÷°å
DVB¡¢ÎÀÐǽÓÊÕ»ú
ÎÞÏßͨѶģ¿é
DVB¡¢ÎÀÐǽÓÊÕ»ú
ÎÞÏßͨѶģ¿é
PCBÖ÷°å
ÊÖ»ú¡¢Ð¡Áéͨ¡¢¶Ô½²»ú
DVD¡¢±ãЯʽ¿ÉÊÓÉ豸
ÊÖ»ú¡¢Ð¡Áéͨ¡¢¶Ô½²»ú
DVD¡¢±ãЯʽ¿ÉÊÓÉ豸
PCBÉè¼Æ·þÎñÓÅÊÆ
1¡¢Ç¿Á¦ºó¶Ü£¬×ÊÉîר¼Ò
±±¾©ÁúÈ˼ÆËã»úÑо¿Ëù×ÊÉîר¼ÒÌṩ¼¼ÊõÖ¸µ¼ºÍ¼¼ÊõÖ§³Ö£¬ÎªÄúµÄPCBÉè¼ÆÖÊÁ¿Ìṩ×îÓÐÁ¦µÄ±£ÕÏ¡£
2¡¢Á÷³ÌÑÏÃÜ£¬¹æ·¶±£ÕÏ
ÑÏÃÜÉè¼ÆÁ÷³Ì£¬Ò»Ë¿²»¹¶µÄÑз¢ÍŶӣ»ÍêÉÆµÄÉè¼Æ¹æ·¶ºÍ¾µä°¸Àý£¬×î´ó³Ì¶È½µµÍÄúµÄÉè¼Æ·çÏÕ¡£
3¡¢ÌùÉí·þÎñ£¬¹æÄ£ÍŶÓ
ÉîÛÚ¡¢±±¾©Á½µØ·þÎñÍøÂ磬³ä·Ö´´Ôì×îºÃµÄ¹µÍ¨£»Ç¿´óµÄÉè¼ÆÍŶӣ¬Âú×ã¿Í»§ÈκÎÇé¿öϵÄÍ»·¢ÐèÇó
4¡¢×ÔÓÐÈí¼þ£¬Ìá¸ßЧÂÊ
רÃųÉÁ¢Æ½Ì¨×飬Õë¶ÔÏÖÓÐÆ½Ì¨¿ª·¢·ûºÏ×Ô¼ºÌØÉ«µÄ¹¤¾ßÈí¼þ£¬¼«´óÌá¸ß¹¤×÷ЧÂÊ£¬Ëõ¶ÌÉè¼ÆÖÜÆÚ¡£
5¡¢½ô¸úÇ°ÑØ£¬Óëʱ¾ã½ø
ËæÊ±¹Ø×¢ÐÐÒµ×îж¯Ì¬£¬½ô¸úÐÐÒµÇ°ÑØ¼¼Êõ£¬ÓëÒµ½çÇ°ÑØ½ôÃܹµÍ¨½»Á÷£¬È·±£¸ß¶ËÉè¼ÆµÃµ½×îºÃ±£ÕÏ
±±¾©ÁúÈ˼ÆËã»úÑо¿Ëù×ÊÉîר¼ÒÌṩ¼¼ÊõÖ¸µ¼ºÍ¼¼ÊõÖ§³Ö£¬ÎªÄúµÄPCBÉè¼ÆÖÊÁ¿Ìṩ×îÓÐÁ¦µÄ±£ÕÏ¡£
2¡¢Á÷³ÌÑÏÃÜ£¬¹æ·¶±£ÕÏ
ÑÏÃÜÉè¼ÆÁ÷³Ì£¬Ò»Ë¿²»¹¶µÄÑз¢ÍŶӣ»ÍêÉÆµÄÉè¼Æ¹æ·¶ºÍ¾µä°¸Àý£¬×î´ó³Ì¶È½µµÍÄúµÄÉè¼Æ·çÏÕ¡£
3¡¢ÌùÉí·þÎñ£¬¹æÄ£ÍŶÓ
ÉîÛÚ¡¢±±¾©Á½µØ·þÎñÍøÂ磬³ä·Ö´´Ôì×îºÃµÄ¹µÍ¨£»Ç¿´óµÄÉè¼ÆÍŶӣ¬Âú×ã¿Í»§ÈκÎÇé¿öϵÄÍ»·¢ÐèÇó
4¡¢×ÔÓÐÈí¼þ£¬Ìá¸ßЧÂÊ
רÃųÉÁ¢Æ½Ì¨×飬Õë¶ÔÏÖÓÐÆ½Ì¨¿ª·¢·ûºÏ×Ô¼ºÌØÉ«µÄ¹¤¾ßÈí¼þ£¬¼«´óÌá¸ß¹¤×÷ЧÂÊ£¬Ëõ¶ÌÉè¼ÆÖÜÆÚ¡£
5¡¢½ô¸úÇ°ÑØ£¬Óëʱ¾ã½ø
ËæÊ±¹Ø×¢ÐÐÒµ×îж¯Ì¬£¬½ô¸úÐÐÒµÇ°ÑØ¼¼Êõ£¬ÓëÒµ½çÇ°ÑØ½ôÃܹµÍ¨½»Á÷£¬È·±£¸ß¶ËÉè¼ÆµÃµ½×îºÃ±£ÕÏ
¸ßÃܶȡ¢Ã¤Âñ¿×PCBÉè¼Æ£¨High Density, B/B PCB design£©
PCBÉè¼ÆÊ±É¢ÈȵĿ¼ÂÇ£¨Thermal consideration in PCB design£©
Éè¼ÆÁ÷³ÌµÄÓÅ»¯£¨Design process optimize£©
ÐÂÓ±µÄÉè¼ÆË¼Â·»ò·½·¨¼¼ÇÉ£¨New design methodology or technology£©
PCBµþ²ã·½°¸µÄÉè¼ÆÓÅ»¯£¨PCB stack-up optimal design£©
ÐźÅÍêÕûÐÔ·ÂÕæºÍ·ÖÎö·½·¨£¨Signal Integrity simulation & analysis£©
°å¼¶EMCÉè¼Æ£¨EMC in board design£©
°å¼¶µçÔ´ÍêÕûÐÔ·ÖÎö£¨Power Integrity analysis£©
SI·ÖÎöÔÚʵ¼Ê²úÆ·Éè¼ÆÖеÄÓ¦Óã¨SI application in practical product design£©
²úÆ·µÄPCBÉè¼Æ·½°¸£¨PCB design technique for a certain product£©
PCBÉè¼ÆµÄµçÔ´´¦Àí¼¼ÇÉ£¨Design skill dealing with Power signals£©
ÍŶÓÐͬºÏ×÷µÄPCBÉè¼Æ£¨Team work in PCB design£©
EDAÈí¼þµÄʵÓù¦Äܼ°Ó¦Óã¨EDA software advanced function & application£©
ÐÂÐͲúÆ·µÄÉè¼Æ¡¢·ÂÕæÈí¼þ£¨Introduct new layout & Simulation£©
IC·â×°»ù°åµÄÉè¼Æ·½·¨£¨IC package design technique£©
Ϊ³É±¾¿¼ÂǵÄPCBÉè¼Æ£¨Design for Cost-down consideration£©